Author:
Zhang Xinfei,Lin Panpan,Lin Jincheng,Zhao Wanqi,Li Xinyue,Yang Jia,Wang Ce,Lin Tiesong,He Peng,Zhuang Yanli
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference35 articles.
1. Chemical vapor deposition single‐crystal diamond: a review;Arnault;Phys. Status Solidi (RRL) – Rapid Res. Lett.,2021
2. Phase equilibria in the system Au–Cu–Si and structural characterization of the new compound Au5±xCu2±xSi;Blazevic;Intermetallics,2014
3. Research progress of diamond/copper composites with high thermal conductivity;Dai;Diam. Relat. Mater.,2020
4. Diamond power devices: state of the art, modelling, figures of merit and future perspective;Donato;J. Phys. D: Appl. Phys.,2019
5. Microstructure and processing performance of brazed diamond drill bits with Ni–Cr + Cu–Ce composite solder;Duan;Diam. Relat. Mater.,2019