A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property

Published:2020-11 Issue: Volume:200 Page:200-210
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Liao Yi-Han,Chen Chang-Hsien,Liang Chien-Lung,Lin Kwang-Lung,Wu Albert T.

Funder

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference54 articles.

1. High lead solder (over 85%) solder in the electronics industry: RoHS exemptions and alternatives,;Menon;J. Mater. Sci. Mater. Electron.,2015

2. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R,2000

3. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

4. Microstructural evolution of intermetallic compounds in TCNCP Cu pillar solder joints,;Liang;J. Electron. Mater.,2016

5. Recent advances on electromigration in very-large-scale-integration of interconnects,;Tu;J. Appl. Phys.,2003

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires: A nanoindentation test with molecular dynamics simulation study;Applied Surface Science;2024-12

2. Effective toughening of dissimilar Ti alloy friction welded joint by combining electropulsing thermal and athermal effects;Materials Science and Engineering: A;2024-09

3. Diffusion of Carbon Quantum Dots on Lithium Liquid Metal for Artificial SEI;Advanced Functional Materials;2024-08-05

4. Development of a novel processing technique for cold-rolled Al-3 Mg aluminum alloys via athermally-enhanced electrical annealing;Materials Letters;2024-08

5. The twin formation under electric current stressing and its effect on the properties of copper;Journal of Materials Research and Technology;2024-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3