Creep and stress relaxation in free-standing thin metal films controlled by coupled surface and grain boundary diffusion
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Grain-boundary grooves and surface diffusion in polycrystalline alumina measured by atomic force microscope
2. Grain-Boundary Grooving and Agglomeration of Alloy Thin Films with a Slow-Diffusing Species
3. The effects of grain grooves on grain boundary migration in nanofilms
4. Crack-like grain-boundary diffusion wedges in thin metal films
5. Grain boundary void growth in bamboo interconnect under thermal residual stress field
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