Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature-Reference-Cited by-同舟云学术

Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature

Published:2013-04 Issue:7 Volume:61 Page:2471-2480
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Marques V.M.F.,Wunderle B.,Johnston C.,Grant P.S.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Implications of Pb-free microelectronics assembly in aerospace applications

2. Second Generation Lead-free Solder Alloys – A Challenge to Thermodynamics

3. Review of methods to predict solder joint reliability under thermo-mechanical cycling

4. Impression creep characterization of rapidly cooled Sn–3.5Ag solders

5. Accelerated testing of creep in polymeric materials using nanoindentation

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