On the role of halides and thiols in additive-assisted copper electroplating-Reference-Cited by-同舟云学术

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On the role of halides and thiols in additive-assisted copper electroplating

Published:2013-02 Issue: Volume:89 Page:537-548
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Huynh Thi M.T.,Weiss Florian,Hai Nguyen T.M.,Reckien Werner,Bredow Thomas,Fluegel Alexander,Arnold Marco,Mayer Dieter,Keller Hubert,Broekmann Peter

Funder

Swiss National Foundation

Marie Heim-Vögtlin program

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference55 articles.

1. Damascene copper electroplating for chip interconnections;Andricacos;IBM Journal of Research and Development,1998

2. Electrochemical materials and processes in Si integrated circuit technology;Dubin;Electrochimica Acta,2007

3. Through silicon via: From the CMOS imager sensor wafer level package to the 3D integration;Gagnard;Microelectronic Engineering,2010

4. The chemistry of additives in damascene copper plating;Vereecken;IBM Journal of Research and Development,2005

5. Superconformal film growth: Mechanism and quantification;Moffat;IBM Journal of Research and Development,2005

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