Author:
Sebastián P.,Torralba E.,Vallés E.,Molina A.,Gómez E.
Subject
Electrochemistry,General Chemical Engineering
Reference40 articles.
1. Recent progress in pulse reversal plating of copper for electronics applications;Leisner;Transactions of the Institute of Metal Finishing,2007
2. Optimisation of copper electrodeposition processes for Si technology based inductive microsystems;Cortés;J. Electroanal. Chem.,2008
3. Advanced copper electroplating for application of electronics;Miura;Surf. & Coat. Technol.,2003
4. Influence of Chloride and Nitrate Anions on Copper Electrodeposition in Ammonia Media;Ramos;J. Electrochem. Soc.,2001
5. IUPAC Stability constants database (SC Database) compilet by L.D. Pettit and K.J. Powell.–Timble: Aacademic Software Pub. 2001 version 5.16. Univ Christchurch. New Zealand.
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