Electroless plating of aluminum using diisobutyl aluminum hydride as liquid reducing agent in room-temperature ionic liquid
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference9 articles.
1. Approaches for patterning of aluminum
2. Development of Aluminum Chemical Mechanical Planarization
3. Nucleation and Morphology Studies of Aluminum Deposited from an Ambient‐Temperature Chloroaluminate Molten Salt
4. Development of Al plating from 1-butylpyridinium chloride-AlCl3 molten salt electrolyte at room temperature.
5. Aluminium deposition and dissolution in aluminium chloride—n-butylpyridinium chloride melts
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