EQCM and EIS characterization of electrochemical deposition of tin from aqueous solution containing pyrophosphate-Reference-Cited by-同舟云学术

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EQCM and EIS characterization of electrochemical deposition of tin from aqueous solution containing pyrophosphate

Published:2019-02 Issue: Volume:296 Page:224-234
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Tuna Kadir,Kilian Arnd,Ressler Thorsten

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference23 articles.

1. The autocatalytic deposition of tin;Warwick;Int. J. Surf. Eng. Coatings,1980

2. Reduction-type Electroless Tin Plating Solution and Tin Plating Films Made by Using the Same;Shimizu,2008

3. Reduction-type Electroless Tin Plating Solution and Tin Plating Films Made by Using the Same;Shigusui,2009

4. Die elektrolytische Abscheidung von Zinnüberzügen aus Pyrophosphatelektrolyten;Purin;Electrodepos. Surf. Treat.,1973

5. A review on the electrochemistry of tin;Ammar;Mater. Chem. Phys.,1989

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. AFM and EIS investigation of the influence of pH on the corrosion film stability of Al4Cu2Mg8Si7 intermetallic particle in aqueous solutions;Applied Surface Science Advances;2022-10

2. Analysis of crystallization and deposition process using electrochemical-quartz crystal microbalance: A review;Journal of Electroanalytical Chemistry;2022-01

3. Autocatalytic tin - how to overcome process limitations to introduce a new solution for thick tin plating;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

4. Characterization of thick tin deposits by autocatalytic reaction and electrochemical investigations of autocatalytic tin electrolytes and their reaction mechanisms;2019 IEEE CPMT Symposium Japan (ICSJ);2019-11

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