Investigations on the corrosion of copper patterns in the course of the “post-CMP cleaning” of integrated electronic microcircuits in oxalic acid aqueous solutions-Reference-Cited by-同舟云学术

Investigations on the corrosion of copper patterns in the course of the “post-CMP cleaning” of integrated electronic microcircuits in oxalic acid aqueous solutions

Published:2007-12 Issue:3 Volume:53 Page:1325-1335
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Bernard M.C.,Gabrielli C.,Joiret S.,Mace C.,Ostermann E.,Pailleret A.

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference33 articles.

1. Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics

2. An introduction to Cu electromigration

3. E. Ostermann, Etude de la croissance dendritique du cuivre dans l’acide oxalique. Application au procédé de nettoyage post-CMP en microélectronique, Ph.D. Thesis, University P. and M. Curie, Paris, France, December 2005.

4. High-selectivity damascene chemical mechanical polishing

5. Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures

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