Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating

Published:2022-01 Issue: Volume:401 Page:139445
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Li Zhen,Tan Baizhao,Luo Jiye,Qin Jinfeng,Yang Guannan,Cui Chengqiang,Pan Li

Funder

National Natural Science Foundation of China

Guangdong University of Technology

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference46 articles.

1. Damascene Copper Electroplating for Chip Interconnections;Andricacos;IBM J. Res. Dev.,1998

2. Copper Electrodeposition for Nanofabrication of Electronics Devices;Kondo,2014

3. Effect of Bis-(3-sulfopropyl) disulfide and chloride ions on the localized electrochemical deposition of copper microstructures;Wang;J. Electrochem. Soc.,2017

4. Influence of SPS decomposition product 1,3-propane disulfonic acid on electrolytic copper via filling performance;Kimizuka;J. Electrochem. Soc.,2015

5. The role of SPS, MPSA, and chloride in additive systems for copper electrodeposition;Tan;J. Electrochem. Soc.,2007

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy;Electrochimica Acta;2024-11

2. Investigation of azathioprine and its local-structure molecules as levelers for through-holes copper electroplating;Surfaces and Interfaces;2024-10

3. Investigation on synthesis and mechanism of a Sudan Ⅰ copper electrodeposition leveler based on influencing ion diffusion strategy;Dyes and Pigments;2024-08

4. Synthesis and application of anthraquinone quaternary phosphonium salt electroplating copper leveler based on expanded electrostatic adsorption area strategy and physicochemical salt bridge mechanism;Applied Surface Science;2024-08

5. Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application;Journal of Manufacturing Processes;2024-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3