Magnetic field-assisted sintering of nickel-doped silver microwire to improve densification and conductivity-Reference-Cited by-同舟云学术

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Magnetic field-assisted sintering of nickel-doped silver microwire to improve densification and conductivity

Published:2020-11 Issue: Volume:513 Page:167232
ISSN:0304-8853
Container-title:Journal of Magnetism and Magnetic Materials
language:en
Short-container-title:Journal of Magnetism and Magnetic Materials

Author:

Jia Bin,Li Qiuen,Ma Liuhong,Li Mengke,Zhong Yinghui,Duan Zhiyong

Funder

National Natural Science Foundation of China

University of Henan Province, China

Publisher

Elsevier BV

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference27 articles.

1. Photoelectric detectors based on inorganic p-type semiconductor materials;Teng;Adv. Mater.,2018

2. Transparent Schottky photodiode based on AgNi NWs/SrTiO3 contact with an ultrafast photoresponse to short-wavelength blue light and UV-shielding effect;Yang;Adv. Funct. Mater.,2019

3. A million spiking-neuron integrated circuit with a scalable communication network and interface;Merolla;Science,2014

4. Zs. Tőkei, I. Ciofi, Ph. Roussel, P. Debacker, P. Raghavan, M.H. van der Veen, N. Jourdan, C.J. Wilson, V.V. Gonzalez, C. Adelmann, L. Wen, K. Croes, O.Varela Pedreira K. Moors, M. Krishtab, S. Armini, J. Bömmels, On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control, 2016 IEEE Symposium on VLSI Technology IEEE, 1–2 (IEEE, 2016).

5. Temperature-stable magnetoimpedance (MI) of current-annealed Co-based amorphous microwires;Dzhumazoda;J. Magn. Magn. Mater.,2019

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1. Microwave sintering Ag nanoparticle interconnects infiltrated by silver acetate ammonia mixed solution;Journal of Materials Science: Materials in Electronics;2023-01

2. Sintering of metal-organic frameworks;Cell Reports Physical Science;2022-06

3. Ag metal interconnect wires formed by pseudoplastic nanoparticles fluid imprinting lithography with microwave assistant sintering;Nanotechnology;2022-04-20

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