Author:
Mulaveesala Ravibabu,Pal Prem,Tuli Suneet
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. Semiconductor Wafer Bonding;Tong,1999
2. Characterization of silicon wafer bonding for power MEMS applications;Ayon;Sens. Actuators A,2003
3. Wafer-to-wafer bonding for microstructure formation;Schmidt;IEEE Proc.,1998
4. Silicon fusion bonding for pressure sensor;Petersen,1988
5. The microfabrication of capacitive ultrasonic transducers;Jin;J. Microelectromech. Syst.,1998
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