Improvements in MEMS gyroscope production as a result of using in situ, aligned, current-limited anodic bonding-Reference-Cited by-同舟云学术

Improvements in MEMS gyroscope production as a result of using in situ, aligned, current-limited anodic bonding

Published:2005-09 Issue: Volume:123-124 Page:106-110
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Rogers Tony,Aitken Nick,Stribley Kevin,Boyd James

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Semiconductor Wafer Bonding Science & Technology;Tong,1999

2. Vibratory gyroscopic sensors;Fox,1984

3. M.P. Varnham, D. Hodgins, T.S. Norris, H.D. Thomas, Vibrating planar gyro, US Patent no. 5226321.

4. E. Obermeier, Anodic wafer bonding, Semiconductor Wafer Bonding: Physics and Applications III, Electrochemical Society, 95–7, 1995, pp. 212–220.

5. Selection of glass, anodic bonding conditions and material compatibility for silicon–glass capacitive pressure sensors;Rogers;Sens. Actuators, A,1995

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