Polymer shrinkage of hot embossed microstructures for higher aspect ratio and smaller size-Reference-Cited by-同舟云学术

Polymer shrinkage of hot embossed microstructures for higher aspect ratio and smaller size

Published:2013-06 Issue: Volume:195 Page:21-26
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Zhu Xuelin,Cui Tianhong

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference28 articles.

1. Imprint of sub-25nm vias and trenches in polymers;Chou;Applied Physics Letters,1995

2. Hot embossing – the molding technique for plastic microstructures;Heckele;Microsystem Technologies,1998

3. Review on micro molding of thermoplastic polymers;Heckele;Journal of Micromechanics and Microengineering,2004

4. Recent progress in nanoimprint technology and its applications;Guo;Journal of Physics D: Applied Physics,2004

5. Nanomoulding with amorphous metals;Kumar;Nature,2009

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