Stabilization of the tilt motion during capillary self-alignment of rectangular chips

Author:

Berthier J.,Brakke K.A.,Mermoz S.,Frétigny C.,Di Cioccio L.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Beyond molecules;Whitesides;PNAS,2002

2. Self assembly at all scales;Whitesides;Science,2002

3. A new self-aligned technique for the assembly of integrated optical devices with optical fibre and electrical interfaces;Wale,2015

4. Self-aligned flip-chip assembly of protonic devices with electrical and optical connections;Wale;IEEE Trans. Compon. Hybrids Manuf. Technol.,1990

5. Self-assembly: The Science of Things That Put Themselves Together;Pelesko,2007

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1. Experimental and Simulative Correlations of the Influence of Solder Volume and Receptor Size on the Capillary Self-Alignment of Micro Solar Cells;Journal of Microelectromechanical Systems;2024-04

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3. Research on technology and isothermal aging of double sided module convex interconnect;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

4. Impact of Pad Layouts and Solder Volume on Self-Alignment of Micro Solar Cells;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

5. Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life;Journal of Electronic Packaging;2023-08-17

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