Author:
Kostrzewa M.,Di Cioccio L.,Zussy M.,Roussin J.C.,Fedeli J.M.,Kernevez N.,Regreny P.,Lagahe-Blanchard Ch.,Aspar B.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Physical reasons for optical interconnection;Miller;Int. J. Optoelectron.,1997
2. Optical interconnects to silicon;Miller;IEEE J. Select. Top. Quant. Electron.,2000
3. On-Chip Optical Interconnect for Low-power in Ultra Low-Power Electronics and Design;O’Connor,2004
4. Optoelectronic-VLSI: photonics integrated with VLSI circuits;Krishnamoorthy;IEEE J. Select. Top. Quant. Electron.,1998
5. Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems;Takahara;IEEE J. Select. Top. Quant. Electron.,2003
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