Induction electrohydrodynamics micropump for high heat flux cooling

Author:

Singhal Vishal,Garimella Suresh V.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Closed-loop electroosmotic microchannel cooling system for VLSI circuits, IEEE Transactions on Components;Jiang;Packaging Manufacturing Technol.,2002

2. Cooling of high-power-density microdevices using liquid metal coolants;Miner;Appl. Phys. Lett.,2004

3. Microscale pumping technologies for microchannel cooling systems;Singhal;Appl. Mechanics Rev.,2004

4. S.V. Garimella, V. Singhal, D. Liu, On-chip thermal management with microchannel heat sinks and integrated micropumps, Proceedings of the IEEE, in press.

5. Traveling-wave bulk electroconvection induced across a temperature gradient;Melcher;Phys. Fluids,1967

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