Author:
Hwang Eun-Soo,Kim Yong-Jun,Ju Byeong-Kwon
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Silicon microstructuring technology;Lang;Mater. Sci. Eng.,1996
2. A graphical representation of the piezoresistance coefficients in silicon;Kanda;IEEE Trans. Electron. Devices,1982
3. G. Klink, M. Feil, F. Ansorge, R. Ascenbrenner, H. Reichl, H. Reichl, Innovative Packaging Concepts for Ultra Thin Integrated Circuit, in: Proceedings of 51st Electronic Component and Technology Conference, Orlando, FL, USA, 29 May–1 June 2001, pp. 1034–1039.
4. Flexible circuit and sensor array fabricated by monolithic silicon technology;Barth;IEEE Trans. Electron. Devices,1985
5. C. Bang, T. Pan, Flexible Heat Flux Sensor Arrays, AFOSR Contractor and Grantee Meetings on Turbulence and Internal Flows, Atlanta, Georgia, 4–6 September 1996.
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献