Protocol on the fabrication of monocrystalline thin semiconductor via crack-assisted layer exfoliation technique for photoelectrochemical water-splitting
Author:
Publisher
Elsevier BV
Subject
General Immunology and Microbiology,General Biochemistry, Genetics and Molecular Biology,General Neuroscience
Reference6 articles.
1. Thin silicon via crack-assisted layer exfoliation for photoelectrochemical water splitting;Lee;iScience,2021
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3. Characterization of atomic-layer-deposited (ALD) Al2O3-passivated sub-50-μm-thick Kerf-less Si wafers by controlled spalling;Lee;Electron. Mater. Lett.,2018
4. Sub-5 μm-thick spalled single crystal Si foils by decoupling crack initiation and propagation;Lee;Appl. Phys. Lett.,2016
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1. From Rigid to Flexible: Progress, Challenges and Prospects of Thin c‐Si Solar Energy Devices;Advanced Energy Materials;2024-05-08
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