Enhanced thermal conductivity in diamond/copper composites with tungsten coatings on diamond particles prepared by magnetron sputtering method
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference36 articles.
1. Highly conductive porous graphene/ceramic composites for heat transfer and thermal energy storage;Zhou;Adv. Funct. Mater.,2013
2. Advances in composite materials for thermal management in electronic packaging;Zweben;JOM,1998
3. High thermal conductivity composite of diamond particles with tungsten coating in a copper matrix for heat sink application;Abyzov;Appl. Therm. Eng.,2012
4. High thermal conductive diamond/Ag-Ti composites fabricated by low-cost cold pressing and vacuum liquid sintering techniques;Lee;Diam. Relat. Mater.,2014
5. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications;Schubert;Scripta Mater.,2008
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