1. Role of interaction forces in controlling the stability and polishing performance of CMP slurries;Basim;J. Colloid Interface Sci.,2003
2. Effect of soft agglomerates on CMP slurry performance;Basim;J. Colloid Interface Sci.,2002
3. Slurry Abrasive Particle Agglomeration Experimentation and Modeling for Chemical Mechanical Planarization (CMP);Johnson,2012
4. Chemical mechanical polish for nanotechnology;Nolan,2012
5. Electrochemical aspects of chemical mechanical polishing;Cadien,2014