Interfacial reactions of high-temperature Zn–Sn solders with Ni substrate
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference27 articles.
1. Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn–Pb solder and Cu/Ni/Pd metallization
2. Isothermal solid-state aging of Pb–5Sn solder bump on Ni/Cu/Ti under bump metallization
3. Cellular to dendritic transition during transient solidification of a eutectic Sn–0.7wt%Cu solder alloy
4. Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder
5. Sn–0.7wt.%Cu/Ni interfacial reactions at 250°C
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1. Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects;Journal of Manufacturing Processes;2022-01
2. Insight into the interatomic competitive mechanism for interfacial stability of room temperature liquid GaInSn/Cu electrode;Materials Chemistry and Physics;2021-09
3. Liquid-State Interfacial Reactions of Sn and Sn-Ag-Cu Solders with p-Type (Bi,Sb)2Te3 Thermoelectric Material;JOM;2020-07-27
4. Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys;JOM;2019-07-01
5. High Temperature Characterization of Binary and Ternary Bi Alloys Microalloyed with Cu and Ag;MATERIALS TRANSACTIONS;2018
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