Investigation of material removal characteristics of Si (100) wafer during linear field atmospheric-pressure plasma etching
Author:
Affiliation:
1. Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore
2. Singapore Institute of Manufacturing Technology, 73 Nanyang Drive, 637662, Singapore
Funder
National University of Singapore
SIMTech
Publisher
AIP Publishing
Subject
Automotive Engineering
Link
https://aip.scitation.org/doi/pdf/10.1016/j.npe.2020.09.003
Reference21 articles.
1. Effect of wafer thinning methods towards fracture strength and topography of silicon die
2. Warpage and mechanical strength studies of ultra thin 150 mm wafers
3. Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration
4. Optimization of Gas Composition Used in Plasma Chemical Vaporization Machining for Figuring of Reaction-Sintered Silicon Carbide with Low Surface Roughness
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