In situ STM study of the duplex passive films formed on Cu(111) and Cu(001) in 0.1 M NaOH
Author:
Publisher
Elsevier BV
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference37 articles.
1. Microstructure and electromigration in copper damascene lines
2. Relationship between microstructure and electromigration damage in unpassivated PVD copper damascene interconnects
3. The investigation of the passive behaviour of copper in weakly acid and alkaline solutions and the examination of the passive film by esca and ISS
4. In situ photoacoustic spectroscopy of thin oxide layers on metal electrodes. Copper in alkaline solution
5. Corrosion and layer formation of passive copper in alkaline solutions
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