Floorplanning for thermal consideration: Slicing with low power on field programmable gate array-Reference-Cited by-同舟云学术

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Floorplanning for thermal consideration: Slicing with low power on field programmable gate array

Published:2022-12 Issue: Volume:24 Page:100491
ISSN:2665-9174
Container-title:Measurement: Sensors
language:en
Short-container-title:Measurement: Sensors

Author:

N Subbulakshmi,Pradeep M.,Kumar Pattem Sampath,Vijay kumar Megavath,N Rajeswaran

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. B -trees: a new representation for nonslicing floorplans;Chang,2000

2. Thermal Aware Floorplanning Incorporating Temperature Dependent Wire Delay Estimation;Winther,2015

3. Elfadel. "Integration of thermal anagement and floorplanning based on three-dimensional layout representations;Budhathoki,2013

4. Electron spectroscopy studies on magneto-optical media and plastic substrate interface;Yorozu,1982

5. Dynamic Thermal Management for Multi-Core Microprocessors Considering Transient Thermal Effects", 2013 18th Asia and South Pacific Design Automation Conference;Liu,2013

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1. A Deep Reinforcement Learning Floorplanning Algorithm Based on Sequence Pairs;Applied Sciences;2024-03-29

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