R&D status of SOI-based pixel detector with 3D stacking readout

Author:

Tsuboyama Toru,Ono Shun,Yamada Miho,Arai Yasuo,Togawa Manabu,Kurachi Ikuo,Ikegami Yoichi,Hara Kazuhiko,Ishikawa Akimasa,Ikebe Masayuki,Motoyoshi Makoto

Funder

JSPS

Japan/US Cooperation Program in the Field of High Energy Physics

KEK Detector Technology Project, Japan

VLSI Design and Education Center (VDEC), the University of Tokyo, Japan

TIA collaborative research program ”Kakehashi” project, Japan

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Au bump connection technology for 3D stacked sensors and detectors;2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD);2023-11-04

2. Tracking and vertex detectors at FCC-ee;The European Physical Journal Plus;2022-02

3. Next frontiers in particle physics detectors: INSTR2020 summary and a look into the future;Journal of Instrumentation;2020-10-22

4. Development of monolithic SOI pixel sensors capable of fine measurements of space and time;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2020-10

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