Enhancing silicon wafer ablation using passive Q-switch <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si12.svg" display="inline" id="d1e848"><mml:mrow><mml:mn>2</mml:mn><mml:mspace class="nbsp" width="1em"/><mml:mi mathvariant="normal">μ</mml:mi><mml:mi mathvariant="normal">m</mml:mi></mml:mrow></mml:math> lasers with third-order nonlinear effects-Reference-Cited by-同舟云学术

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Enhancing silicon wafer ablation using passive Q-switch 2μm lasers with third-order nonlinear effects

Published:2024-12 Issue: Volume:179 Page:111316
ISSN:0030-3992
Container-title:Optics & Laser Technology
language:en
Short-container-title:Optics & Laser Technology

Author:

Perez Asher^ORCID,Kotzero Tomer,Perez Eytan,Juwiler Irit^ORCID,Noach Salman

Publisher

Elsevier BV

Reference47 articles.

1. A review of laser ablation and dicing of Si wafers;Marks;Precis. Eng.,2022

2. A review on laser drilling and cutting of silicon;Wang;J. Eur. Ceram. Soc.,2021

3. Laser processing of silicon with GHz burst pumped third harmonics for precise microfabrication;Sakurai;Opt. Express,2023

4. Analysis of silicon via hole drilling for wafer level chip stacking by UV laser;Lee;Int. J. Precis. Eng. Manuf. Technol.,2010

5. Studies on laser ablation of silicon using near IR picosecond and deep UV nanosecond lasers;Shaheen;Opt. Lasers Eng.,2019

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