Investigation on the Electrochemical-Mechanical Polishing of NiP Substrate of Hard Disk
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference16 articles.
1. Characterization of copper chemical mechanical polishing (CMP) in nitric acid–hydrazine based slurry for microelectronic fabrication
2. Effect of Applied Potential on the Chemical Mechanical Polishing of Aluminum in Phosphoric Acid Base Slurry
3. High-selectivity damascene chemical mechanical polishing
4. Effect of glycine and hydrogen peroxide on chemical–mechanical planarization of copper
5. Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization
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1. Review—Principles and Applications of Electrochemical Polishing;Journal of The Electrochemical Society;2024-09-02
2. Ring-pendulum Double-sided Polisher with Improved Super Twisting Sliding Mode Active Disturbance Rejection Control;2022 34th Chinese Control and Decision Conference (CCDC);2022-08-15
3. Environment Friendly Dry Electrochemical Polishing of Nickel with Ion-Exchange Resin Particles Wetted by Deep Eutectic Solvent;SSRN Electronic Journal;2022
4. Environment Friendly Dry Electrochemical Polishing of Nickel with Ion-Exchange Resin Particles Wetted by Deep Eutectic Solvent;SSRN Electronic Journal;2022
5. Application of BIB polishing technology in cross-section preparation of porous, layered and powder materials: A review;Frontiers of Materials Science;2019-05-02
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