Effect of thermal cycling on the strain and stress distribution of TSVs and solder bumps in stacked package structure-Reference-Cited by-同舟云学术

Effect of thermal cycling on the strain and stress distribution of TSVs and solder bumps in stacked package structure

Published:2023-09 Issue: Volume:5 Page:100274
ISSN:2772-6711
Container-title:e-Prime - Advances in Electrical Engineering, Electronics and Energy
language:en
Short-container-title:e-Prime - Advances in Electrical Engineering, Electronics and Energy

Author:

Xia Yangjing,Su Yahui,Xu Xin,Ju Lina,Zhang Rui,Xue Yuxiong,Liu Yang^ORCID,Zhang Shuye

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,General Engineering,Energy Engineering and Power Technology

Reference20 articles.

3. LGA solder joint reliability and thermal fatigue life prediction;Jin;Electron. Compon. Mater.,2021

4. Structure optimization design of BGA solder joints based on surface response method;Yang;Hanjie Xuebao,2023

5. Thermomechanical reliabilities of Pb-free solder joints according to Ag content in harsh environment;Kim;IEEE Trans. Reliab.,2023

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献