Ultrasonic vibration used for improving interfacial adhesion strength between metal substrate and high-aspect-ratio thick SU-8 photoresist mould
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Acoustics and Ultrasonics
Reference18 articles.
1. Thermophysical analysis of SU8-modified microstructures created by visible light lithography;Ponce;J. Polym. Sci. Pol. Phys.,2010
2. SU-8 as a structural material for labs-on-chips and microelectromechanical systems;Abgrall;Electrophoresis,2007
3. Fabrication of multi-layer SU-8 microstructures;Mata;J. Micromech. Microeng.,2006
4. Fabrication of high-aspect ratio SU-8 micropillar arrays;Amato;Microelectron. Eng.,2012
5. Process research of high aspect ratio microstructure using SU-8 resist;Liu;Microsyst. Technol.,2004
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