Acoustic emission source location in plates using wavelet analysis and cross time frequency spectrum
Author:
Publisher
Elsevier BV
Subject
Acoustics and Ultrasonics
Reference15 articles.
1. Application of wavelet transform on modal acoustic emission source location in thin plates with one sensor;Jiao;Int. J. Press. Vessels Pip.,2004
2. Source location in thin plates using cross-correlation;Ziola;J. Acoust. Soc. Am.,1991
3. Acoustic emission source location in two dimensions by an array of three sensors;Toibas;Nondestr. Test.,1976
4. Acoustic emission in wide composite specimens;Scholey;Adv. Mater. Res.,2006
5. A new method for waveform analysis for estimating AE wave arrival times using wavelet decomposition;Ding;NDT E Int.,2004
Cited by 53 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Probabilistic impact localization in composites using wavelet scattering transform and multi-output Gaussian process regression;Measurement;2024-08
2. Damage Localization, Identification and Evolution Studies during Quasi-Static Indentation of CFRP Composite Using Acoustic Emission;Polymers;2023-12-07
3. Automatic recognition of effective and interference signals based on machine learning: A case study of acoustic emission and electromagnetic radiation;International Journal of Rock Mechanics and Mining Sciences;2023-10
4. Application of Acoustic Emission as Damage Assessment Technique for Performance Evaluation of Concrete Structures: A Review;Practice Periodical on Structural Design and Construction;2023-08
5. Signal Processing of Infrasound Leakage in Urban Pipelines Based on Spectral Analysis;Journal of Pipeline Systems Engineering and Practice;2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3