Effect of temperature on the low cycle fatigue behavior of Glidcop Al-15

Author:

Daoud Abderrazak,Vogt Jean-Bernard,Charkaluk Eric,Zhang Lin,Biasci Jean-Claude

Publisher

Elsevier BV

Subject

Applied Mathematics

Reference16 articles.

1. L Zhang, J-C Biasci, B Plan, ESRF Thermal Absorbers Temperature Stress and Material Criteria. 2nd International Workshop on Mechanical Engineering Design of Synchrotron Radiation Equipment and Instrumentation; September 5-6, 2002 — Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois U.S.A..

2. V Ravindranath, S Sharma, B Rusthoven, M Gosz, L Zhang, J-C Biasci, Thermal Fatigue Life Prediction of Glidcop® Al-15.

3. Fatigue life prediction for high-heat-load components made of Glidcop by elastic-plastic analysis;Sunao;J. Synchrotron Rad.,2008

4. AV Nadkarni, JD Troxell, F Verniers, GlidCop: dispersion strengthened copper: an advanced copper alloy system for automotive and aerospace applications; Internal Report; SCM Metal Products Inc; Cleveland, OH, USA..

5. Abnormal grain growth in alumina dispersion-strengthened copper produced by an internal oxidation process;Afshara;Scripta Materialia,2008

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