Effect of small-sized modifier on boron nitride for efficient heat transfer through thermal conductive epoxy composites

Author:

Shin Dong-In,Lee Jisung,Kim Mi Ri,Jeong Sooyeol,Park Ji-In,Baik Sangyul,Yi Gi-Ra,Park Seung-Young,Lee GaehangORCID

Funder

Ministry of Science, ICT and Future Planning

Korea Basic Science Institute

Korea Ministry of Science and ICT

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference41 articles.

1. Electronic Packaging Materials and Their Properties;Pecht,2017

2. Interfacial engineering of epoxy/silica nanocomposites by amino-rich polyethyleneimine towards simultaneously enhanced rheological and thermal-mechanical performance for electronic packaging application;Guo;Compos. B Eng.,2022

3. Simultaneously improved thermal conductivity and dielectric properties of NBR composites by constructing 3D hybrid filler networks;Xie;Macromol. Mater. Eng.,2023

4. Advanced on thermally conductive epoxy-based composites as electronic packaging underfill materials - a review;Wen;Adv. Mater.,2022

5. Recent advances in polymer-based electronic packaging materials;Wan;Compos. Commun.,2020

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