Co contamination of Si: Plating & aging

Author:

Wang JintaoORCID,Ke Dingning,Tian Feng,Xiong Li,Chen Hongtao,Li Mingyu

Publisher

Elsevier BV

Reference25 articles.

1. Co-doped Ru liners for highly reliable Cu interconnects with selective Co cap;Motoyama,2020

2. Power delivery design, signal routing, and performance of on-chip cobalt interconnects in advanced technology nodes;Lanzillo;IEEE Trans. Very Large Scale Integr. Syst.,2022

3. Sub-100 nm2 cobalt interconnects;Dutta;IEEE Electron. Device Lett.,2018

4. Electroplating of Zn-Ni alloy coating on mild steel and its electrochemical studies;Bhat;J. Mater. Eng. Perform.,2021

5. Physics of copper in silicon;Istratov;J. Electrochem. Soc.,2002

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