Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens-Reference-Cited by-同舟云学术

Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens

Published:2002 Issue:6 Volume:21 Page:725-733
ISSN:0142-9418
Container-title:Polymer Testing
language:en
Short-container-title:Polymer Testing

Author:

Shi X.Q.,Wang Z.P.,Pang H.L.J.,Zhang X.R.

Publisher

Elsevier BV

Subject

Polymers and Plastics,Organic Chemistry

Reference16 articles.

1. Towards a better understanding of underfill encapsulation for flip chip technology: proposed developments for the future

2. Flip Chip Technologies;Lau,1996

3. Z.N. Cheng, L. Chen, G.Z. Wang, X.M.Xie, Q. Zhang, in: Proceedings of International Symposium on Electronic Materials and Packaging, Hong Kong, 2000, pp. 232–239.

4. Humidity effects on adhesion strength between solder ball and epoxy underfills

5. Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

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