Properties improvement and microstructure changes during thermomechanical treatment in sintered Cu–Au alloy

Author:

MARKOVIC Ivana,NESTOROVIC Svetlana,MARKOVIC Desimir,GUSKOVIC Dragoslav

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference30 articles.

1. Effects of fine fiber structures on the mechanical and electrical properties of cold rolled Cu–Ag sheet [J];LEE;Journal of Materials Science Letters,2003

2. Influence of annealing treatment on properties and microstructures of alumina dispersion strengthened copper alloy [J];SONG;Transactions of Nonferrous Metals Society of China,2005

3. Electronic structure of the Cu3Au(111) surface [J];LEKKA;Applied Surface Science,2003

4. Electronic structure of Au-Cu alloys [J];YU;Transactions of Nonferrous Metals Society of China,2004

5. Dislocation configurations in ordered copper-10 at.% gold solid solutions [J];ROSNER;Materials Science and Engineering A,1998

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