Plasma Etching in Microelectronics
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Publisher
Elsevier
Reference35 articles.
1. Charging of pattern features during plasma etching;Arnold;Journal of Applied Physics,1991
2. Pulsed high-density plasmas for advanced dry etching processes;Banna;Journal of Vacuum Science & Technology A,2012
3. Kinetic study of low energy ion-enhanced polysilicon etching using Cl, Cl2, and Cl+ beam scattering;Chang;Journal of Vacuum Science & Technology A,1997
4. Analyses of chamber wall coatings during the patterning of ultralow-k materials with a metal hard mask: consequences on cleaning strategies;Chevolleau;Journal of Vacuum Science & Technology B,2007
5. Lecture Notes on Principles of Plasma Processing;Chen,2012
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microelectromechanical Systems (MEMS) for Biomedical Applications;Micromachines;2022-01-22
2. Multiscale modeling of plasma–surface interaction—General picture and a case study of Si and SiO2 etching by fluorocarbon-based plasmas;Applied Physics Reviews;2021-12
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