Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach-Reference-Cited by-同舟云学术

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Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach

Published:2016-11 Issue: Volume:109 Page:182-200
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Bayomy A.M.,Saghir M.Z.,Yousefi T.

Funder

National Science and Engineering Research Council (NSERC)

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference40 articles.

1. Convection performance of nanofluids for electronics cooling;Lee,2009

2. The Intel Pentium M processor: microarchitecture and performance;Gochman;Int Technol J,2003

3. Review on thermal transport in high porosity cellular metal foams with open cells;Zhao;Int J Heat Mass Transf,2012

4. Measurement of interstitial convective heat transfer and frictional drag for flow across metal foams;Hwang;J Heat Transf,2002

5. Thermal analysis on metal foam filled heat exchangers Part I: metal-foam filled pipes;Lu;Int J Heat Mass Transf,2006

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