Infeed Grinding of Silicon Wafers Applying Electrophoretic Deposition of Ultrafine Abrasives

Author:

Tani Y.,Saeki T.,Samitsu Y.,Kobayashi K.,Sato Y.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference6 articles.

1. Abe, T., 1989, Future Technology in Si Wafering Process for VLSl, Proc. of 5th Precision Engineering Seminar, 18-22.

2. Nanometer Grinding Using Ultrafine Abrasive Pellets;Ikeno;Annals of the CIRP,1990

3. Development of Highly Homogeneous Pellets Applying Electrophoretic deposition of Ultrafine Abrasives for Nanometer Grinding;Ikeno;Annals of the CIRP,1994

4. Development of Chipping-Free Dicing Technology Applying Electrophoretic deposition of Ultrafine Abrasives;Ikeno;Annals of the CIRP,1991

5. Electric Field-Assisted Fine Finishing Using Electrophoresis Phenomenon;Kurobe;J. of JSPE,1986

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