1. Application of digital PGA technology to k band microcircuit and microwave subsystem package;Hongwei;IEEE Trans. Microw. Theory Technol.,2000
2. The evolution of packages for monolithic microwave and millimeterwave circuits;Midford;IEEE Trans. Antennas Propagation,1995
3. Ceramic and glass packaging in the 1990s;Tummala Rao;J. Am. Ceram. Soc.,1991
4. Low temperature cofireable ceramics;Eustice,1986
5. RF design considerations for passive elements in LTCC material systems;Muller;Int. J. Microcircuits Electron. Packaging,1995