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Interface instability in the drawing process of copper/tantalum conductors

  • Published:1999-02 Issue:3 Volume:47 Page:853-857
  • ISSN:1359-6454
  • Container-title:Acta Materialia
  • language:en
  • Short-container-title:Acta Materialia

Author:

Thilly L,Colin J,Lecouturier F,Peyrade J.P,Grilhé J,Askénazy S

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

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