Influence of the additives (TU) and (PEG) on the underpotential deposition of copper on platinum electrodes: a coulometric, microgravimetric and topographic study-Reference-Cited by-同舟云学术

Influence of the additives (TU) and (PEG) on the underpotential deposition of copper on platinum electrodes: a coulometric, microgravimetric and topographic study

Published:1993-04 Issue:5 Volume:38 Page:647-652
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Wünsche M.,Nichols R.J.,Schumacher R.,Beckmann W.,Meyer H.

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference18 articles.

1. Inhibition of the underpotential deposition of copper on single crystalline platinum surfaces

2. Preparation of monocrystalline Pt microelectrodes and electrochemical study of the plane surfaces cut in the direction of the {111} and {110} planes

3. Die Quarzmikrowaage: Eine neue Meßtechnik zur in-situ-Untersuchung des Phasengrenzbereiches fest/flüssig

4. An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additive

5. Electrochemical faceting of metal electrodes

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