Recrystallization of boron-doped and undoped preamorphized silicon layers by rapid and conventional thermal annealing
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference21 articles.
1. Silicon preamorphization and shallow junction formation for ULSI circuits
2. Material and electrical properties of ultra-shallow p/sup +/-n junctions formed by low-energy ion implantation and rapid thermal annealing
3. Studies on the lattice position of boron in silicon†
4. The enhanced diffusion of boron in silicon after high-dose implantation and during rapid thermal annealing
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1. High-resolution scanning near-field EBIC microscopy: Application to the characterisation of a shallow ion implanted p+–n silicon junction;Ultramicroscopy;2008-05
2. Fluorine-enhanced boron diffusion in germanium-preamorphized silicon;Journal of Applied Physics;2005-10
3. Enhanced Boron Diffusion in Amorphous Silicon;MRS Proceedings;2004
4. Electrically active defects in BF2+ implanted and germanium preamorphized silicon;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1998-02
5. Boron Diffusion in Pre-Amorphised Silicon: Interactions with the End of Range Defects;Defect and Diffusion Forum;1997-11
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