Optical emission end point detection for via hole etching in InP and GaAs power device structures
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
1. Dry etching of through substrate via holes for GaAs MMIC’s
2. Application of plasma etching to via hole fabrication in thick GaAs substrates
3. Hybrid dry-wet chemical etching process for via holes for gallium arsenide MMIC manufacturing
4. Dry etching of via connections for GaAs monolithic microwave integrated circuits fabrication
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