1. STEP Application Protocol 210 (AP 210) defines the schema for the electronic assembly, interconnect and packaging design of Printed Circuit Assemblies (www.pdesinc.aticorp.org).
2. STEP (STandard for the Exchange of Product model data) is a key international product data technology that provides an unambiguous, computer sensible description of the physical and functional characteristics of a product throughout its life (www.pdesinc.aticorp.org).
3. Gerber is a proprietary standard that defines lands, patterns and artwork in a single file for the design and fabrication of Printed Circuit boards (www.gencam.org).
4. Intermediate Data Format (IDF) is a standard for transferring printed circuit assembly (PCA) data between PCB layout and mechanical design (www.intermedius.com/html/idf_overview.htm).
5. GenCAM is a standard format that integrates functional descriptions for printed circuit boards and printed circuit assemblies for exchange between Printed Circuit design and manufacturing applications (www.gencad.org).