Numerical investigation of residual stress fields and crack behavior in TBC systems-Reference-Cited by-同舟云学术

Numerical investigation of residual stress fields and crack behavior in TBC systems

Published:2002-08 Issue:1-2 Volume:333 Page:351-360
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Sfar K,Aktaa J,Munz D

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

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5. H. Zimmermann, Thermoschock- und Temperaturwechselverhalten verschiedener keramischer Materialien, Reports of the Institute for Materials Research,FZK 5303, Karlsruhe, 1994.

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