1. Y. Nishiyama, T. Miyashita, S. Isobe, T. Noda, in: S.H. Hang et al. (Eds.), High Temperature Aluminides and Intermetallics, TMS, Warrendale, PA, 1990, p. 557.
2. K. Maki, A. Ehira, M. Sayashi, T. Noda, M. Okabe, S. Isobe, SAE Technical Paper No. 960303, 1996, p. 117.
3. H. Horn, in: Proc. Eurojoin 1: 1st Eur. Conf. on Joining Technology, Institut de Soudure, Paris, France, 1991, p. 441.
4. Diffusion Bonding of Intermetallic Compound TiAl.