Mechanical and thermal performance of distillers grains filled poly(butylene succinate) composites
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference36 articles.
1. Effect of gelatinization and additives on morphology and thermal behavior of corn starch/PVA blend films;Luo;Carbohydr Polym,2012
2. Pine cone fiber/clay hybrid composite: mechanical and thermal properties;Arrakhiz;Mater Des,2013
3. Property improvement of thermoplastic mung bean starch using cotton fiber and low-density polyethylene;Prachayawarakorn;Starch-Stärke,2010
4. Production of natural fiber reinforced thermoplastic composites through the use of polyhydroxybutyrate-rich biomass;Coats;Bioresour Technol,2008
5. Evaluation of cotton byproducts as fillers for poly(lactic acid) and low density polyethylene;Sutivisedsak;Ind Crops Prod,2012
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