Fracture behavior of thermally aged Ag–Cu composite sinter joint through microscale tensile test coupled with nano X-ray computed tomography-Reference-Cited by-同舟云学术

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Fracture behavior of thermally aged Ag–Cu composite sinter joint through microscale tensile test coupled with nano X-ray computed tomography

Published:2021-08 Issue: Volume:206 Page:109818
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Matsuda Tomoki,Yamada Seigo,Takeuchi Akihisa,Uesugi Kentaro,Yasutake Masahiro,Sano Tomokazu,Ohata Mitsuru,Hirose Akio

Funder

Japan Society for the Promotion of Science

New Energy and Industrial Technology Development Organization

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference42 articles.

1. Wide bandgap semiconductor materials for high temperature electronics;Chalker;Thin Solid Films,1999

2. Metal–metal bonding process using Ag metallo-organic nanoparticles;Ide;Acta Mater.,2005

3. Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly;Bai;IEEE Trans. Device Mater. Reliab.,2006

4. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment;Yu;Mater. Des.,2009

5. Are sintered silver joints ready for use as interconnect material in microelectronic packaging?;Siow;J. Electron. Mater.,2014

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced thermal stability of joints formed by Ag-Cu supersaturated solid-solution nanoparticles paste by in-situ Cu nanoprecipitates;Journal of Materials Science & Technology;2025-04

2. Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles;Journal of Laser Applications;2024-06-05

3. Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics;Materials Letters;2024-02

4. Crack initiation and propagation behavior of dissimilar interface with intermetallic compound layer in Al/steel joint using coupled multiscale mechanical testing;Materials & Design;2023-11

5. Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol;Journal of Materials Science;2023-10

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