Author:
Ma Xue,Li Liangfeng,Zhang Zuhua,Wang Hao,Wang Enze,Qiu Tai
Funder
State Key Laboratory Cultivation Base for Nonmetal Composites and Functional Materials
Scientific Research Fund
China Scholarship Council
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference22 articles.
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4. Microstructure, solderability, and growth of intermetallic compounds of Sn–Ag–Cu–RE lead-free solder alloys;Law;J. Electron. Mater.,2006
5. Intermetallic compound formation at Sn–3.0Ag–0.5Cu–1.0Zn lead free solder alloy/Cu interface during as-soldered and as-aged conditions;Wang;J. Alloys Compd.,2007
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